KUALA LUMPUR, Teledyne DALSA, a Teledyne Technologies company, has introduced the Linea HS2 TDI line scan camera family, representing a significant breakthrough in next generation time delay and integration (TDI) technology. Designed for ultra-high-speed imaging in light starved conditions, it delivers exceptional image quality with 16k/5 micrometres (µm) resolution and boasts an industry leading maximum line rate of one megahertz, or 16 gigapixels per second data throughput. The Linea HS2 features a highly sensitive Backside Illuminated (BSI) multi-array charge-domain TDI CMOS sensor with 16k/5 µm resolution and optimised Quantum Efficiency, meeting the rigorous demands of current and future machine vision applications. In a statement, Teledyne DALSA said the multi-array TDI sensor architecture allowed the camera to be configured for superior image quality with maximised line rate, dynamic range, or full well, according to specific application requirements. This makes it particularly ideal for inspectin g semiconductor wafers, high density interconnects and flat panel displays, as well as for life science applications, in addition to on-chip binning that enables higher web speeds to boost system throughput. Linea HS2 offers a seamless upgrade from Teledyne's existing Linea HS line scan cameras, featuring the same pixel size, optics, cables, and mounting hardware, but with a 2.5-time increase in speed, while maintaining reasonable power consumption. For a complete solution, the Linea HS2 camera works with Teledyne's Xtium2 CLHS series of high-performance frame grabbers, utilising next-generation CLHS technology. Source: BERNAMA News Agency